| 摘要 |
PURPOSE: A method for manufacturing a gas injector for a semiconductor wafer deposition device and the gas injector are provided to block a temperature rise of the gas injector by including a cooling unit for cooling the tube and the plate in the gas injector. CONSTITUTION: A first plate in which a first tube hole is formed and a second plate in which a second tube is formed are prepared(S110). A brazing film is attached to an upper side of the first plate and the second plate(S120). A part covering the first tube hole and the second tube hole is punched(S130). The punched brazing film is attached and the tube is inserted to the first plate and the second plate(S140). The combination of the first plate, the second plate, and the tube is positioned on the high temperature chamber and is heated. The tube hole and the outer circumference of the tube are brazed by fusing the brazing film(S150).
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