发明名称 |
ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME |
摘要 |
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
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申请公布号 |
US2009323299(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090553815 |
申请日期 |
2009.09.03 |
申请人 |
HITACHI CABLE, LTD.;NEC ELECTRONICS COPORATION |
发明人 |
MIYAMOTO NOBUAKI;CHINDA AKIRA;HIRASAWA KOKI;UCHIDA KENJI |
分类号 |
H05K7/00;H05K3/46 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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