发明名称 ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME
摘要 An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
申请公布号 US2009323299(A1) 申请公布日期 2009.12.31
申请号 US20090553815 申请日期 2009.09.03
申请人 HITACHI CABLE, LTD.;NEC ELECTRONICS COPORATION 发明人 MIYAMOTO NOBUAKI;CHINDA AKIRA;HIRASAWA KOKI;UCHIDA KENJI
分类号 H05K7/00;H05K3/46 主分类号 H05K7/00
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