发明名称 |
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 mum or greater but less than 10 mum and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
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申请公布号 |
US2009321116(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090557076 |
申请日期 |
2009.09.10 |
申请人 |
ARIFUKU MOTOHIRO;WATANABE ITSUO;GOTOU YASUSHI;KOBAYASHI KOUJI;KOJIMA KAZUYOSHI |
发明人 |
ARIFUKU MOTOHIRO;WATANABE ITSUO;GOTOU YASUSHI;KOBAYASHI KOUJI;KOJIMA KAZUYOSHI |
分类号 |
H05K1/09;C09J9/02;C09J163/00;H01B1/22;H01L21/60;H05K1/03;H05K1/11;H05K3/32;H05K3/34 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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