| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus that improves adhesion between an electrode on a ferroelectric and a conductive plug connected to the same. SOLUTION: The method of manufacturing a semiconductor apparatus 1 includes: a step of forming a first conductive film 40a on a substrate 10; a step of forming a ferroelectric film 41a on the first conductive film 40a; a step of forming a second conductive film 42a on the ferroelectric film 41a; a step of forming a hard mask 100 including a metal on the second conductive film 42a; a step of removing a region not covered by the hard mask 100 of the second conductive film 42a with remaining a region under the hard mask 100 of the second conductive film 42a; and a step of removing the hard mask 100 and a surface layer of the second conductive film 42a under the hard mask 100 by dry etching. COPYRIGHT: (C)2010,JPO&INPIT |
