发明名称 FLEXIBLE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an FPC exhibiting an adhesive force, with less transmission loss. SOLUTION: Relating to a both-sided FPC where surface protection insulating materials 4a and 4b are formed, a silica hybrid material solution is applied on a part of ground circuits 3a and 3b and the surfaces of surface protection insulating materials 4a and 4b. Primer layers 5a and 5b comprising cured material thereof are dried to be a polyimide film, and then a preplating process is performed. At that time, silica particles of nano size in the surface of cured silica hybrid drop to form an anchor layer. Electroless plating is applied on the anchor layer surface to form seed layers 6a and 6b, and then a metal film is formed by electrolytic platings 7a and 7b. Then, by etching, unrequired portions of the seed layers 6a and 6b and electrolytic platings 7a and 7b are removed. A surface protection insulating layer is formed on their surfaces. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009302144(A) 申请公布日期 2009.12.24
申请号 JP20080152049 申请日期 2008.06.10
申请人 NIPPON MEKTRON LTD 发明人 ORUI MANABU;UCHIDA HITOSHI;TANAKA HIDEAKI;IKEDA HIROYUKI
分类号 H05K3/38;H05K1/02;H05K3/18 主分类号 H05K3/38
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