| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method that unite an adherend with a ring frame with an adhesive sheet interposed under reduced pressure without requiring complicated pressure reduction control. SOLUTION: The mounting device includes the ring frame RF, a table 11 for supporting a semiconductor wafer W, a sticking means 13 of sticking an adhesive sheet S on the ring frame RF, a case 12 which houses the table 11 and in which a single pressure-reduced chamber C is formed, and a clamping means 37 disposed opposite the table 11. The clamping means 37 cooperates with the table 11 to clamp only an outer peripheral portion of the semiconductor wafer W together with the adhesive sheet S in a state wherein the pressure in the pressure-reduced chamber C is reduced. The pressure-reduced chamber C is released from being reduced in pressure to stick the semiconductor wafer W on the adhesive sheet S, to that the semiconductor wafer W and ring frame RF are united. COPYRIGHT: (C)2010,JPO&INPIT |
