发明名称 METHOD FOR FORMING COMPOUND PLATING FILM, AND MANUFACTURING METHOD OF INKJET RECORDING HEAD
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a compound plating film capable of uniformly dispersing fine particles in a plating film and suppressing generation of pin holes, voids and nodules, and a manufacturing method of an inkjet recording head having excellent wiping resistance, ink resistance and discharging consistency. SOLUTION: The compound plating film is formed by bringing an object to be plated into contact with a fluid mixture in which high-pressure fluid and plating liquid containing fine particles are mixed and stirred. When manufacturing an inkjet recording head, a plating protective film 14 is deposited on a surface opposite to the ink discharging side of a nozzle plate 11, and preferably, the compound plating film 16 is deposited on the surface on the ink discharging side by bringing the nozzle plate into contact with fluid mixture in which supercritical carbon dioxide and plating liquid containing liquid-repellent fine particles and surfactant are mixed with each other and stirred. After the plating, the plating protective film is removed from the nozzle plate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009293068(A) 申请公布日期 2009.12.17
申请号 JP20080146112 申请日期 2008.06.03
申请人 FUJIFILM CORP 发明人 UCHIYAMA HIROMIKI
分类号 C23C18/52;B41J2/135;C25D5/00;C25D7/00;C25D15/02 主分类号 C23C18/52
代理机构 代理人
主权项
地址