PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

A plasma processing apparatus is characterized by being provided with a process container capable of maintaining an atmosphere the pressure of which is reduced below the atmospheric pressure, an evacuation means for reducing the pressure in the process container to a predetermined pressure, a gas introducing means for introducing a process gas into the process container, a microwave introducing means for introducing a microwave into the process container, and a lifter pin for supporting an object to be processed on the end surface thereof, which is ascendably and descendably inserted into a mounting table provided in the process container, wherein when plasma is ignited by introducing the microwave, the object to be processed is supported at a first position near the upper surface of the mounting table by the lifter pin, and after the plasma is ignited, the object to be processed is supported at a second position remoter from the mounting table than the first position by the lifter pin.  An improvement in plasma ignition rate can be achieved.