发明名称 |
SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF |
摘要 |
A chip (2, 3) is arranged on an upper side of a flexible support (1) and mechanically separate from the support. Electrical connections (8, 11) for the chip are executed with a planar connection technique. The chip can be separated from the support by means of an air gap or a base layer (7) made of a soft or compressible material. |
申请公布号 |
WO2009150087(A2) |
申请公布日期 |
2009.12.17 |
申请号 |
WO2009EP56832 |
申请日期 |
2009.06.03 |
申请人 |
EPCOS AG;PAHL, WOLFGANG;WEIDNER, KARL |
发明人 |
PAHL, WOLFGANG;WEIDNER, KARL |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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