| 摘要 |
<p>A method of cutting or perforating a thin film (10) comprises the steps of applying an energy-absorbing material (14) at a selected location (15) or at selected locations (11) on a surface of the film, wherein the energy-absorbing material absorbs electromagnetic energy in a predetermined frequency range. Further, the method includes irradiating the energy-absorbing material at said location or said selected locations with a laser of sufficient energy in the predetermined frequency range, so as to heat the energy-absorbing material to an extent that a portion of the film adjacent to the energy-absorbing material is removed, thereby cutting the film or generating a perforation in the film.</p> |
