METHOD FOR MANUFACTURING SEMICONDUCTOR COMPOSITE DEVICE

摘要

PROBLEM TO BE SOLVED: To easily form an element-separated discrete semiconductor element on a substrate with high positional accuracy, in a method for manufacturing a semiconductor composite device manufactured by sticking a semiconductor thin film onto a substrate.

SOLUTION: This method for manufacturing a semiconductor composite device includes processes of: sticking the semiconductor thin film 120 of a thin film to the substrate 301 by intermolecular force between a sticking surface of the semiconductor thin film 120 and a surface of a conducting layer 302 formed on the substrate 301; and dividing the semiconductor thin film 120 into individual semiconductor elements (light emitting elements) 501 collectively on the substrate 301.

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