| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce failures in manufacture of a semiconductor device by unitarily collecting and managing alarms to be output from a plurality of abnormality monitoring system for monitoring a semiconductor device manufacturing device and an inspection device, etc. Ž<P>SOLUTION: When an alarm collection processing part 2 is received the alarm to be output from systems S1-S3, registers received data in a database 4, and determines presence/absence of device shutdown, groundbreaking shutdown from stop condition information on the device and groundbreaking. In the case of shutdown, the device shutdown or the groundbreaking shutdown is instructed, and generation of the alarm sends an e-mail to members registered in the database 4. When a cause of the alarm is registered, a circulation processing part 3 of an abnormality connection slip notifies the next operator of the registered cause of the alarm by e-mail. When its action is registered, the next operator is notified of the e-mail, presence/absence of scrap of a semiconductor wafer is registered, in the case of OK, its result sends an e-mail to all the members, in the case of NG, the next input person is notified by the e-mail, and when a scrap-processing of the semiconductor wafer is performed is registered, all the members are notified by the e-mail. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
