| 摘要 |
To provide a substrate processing apparatus capable of uniformly processing substrates without applying excessive force to the substrates and without being affected by the standing time. The substrate processing apparatus includes a holding portion 2 that holds the substrate 1 after molding, and a flow rectification portion 3 disposed near the substrate 1 that is held by the holding portion 2. The flow rectification portion 3 includes a facing portion 33 opposed to and near to one side of the substrate 1, an inlet portion 32 for introducing cooling gas G between the facing surface 33 and the substrate 1, and a drive unit that rotates the facing portion 33. Fins 34 are formed in the facing portion 33.
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