发明名称
摘要 An integrated circuit includes a first plate-shaped part and at least a plate-shaped second part separate from the first part and attached to the first part by deformable mechanical connection defining a non-zero angle with the first part. A method of producing the integrated circuit includes depositing deformable connecting means in contact with a first portion of the structure and a second portion of the structure, etching the structure to separate the first portion and the second portion, relatively moving the first and second portions to deform the connecting means and fastening together the first portion and the second portion.
申请公布号 JP2009543086(A) 申请公布日期 2009.12.03
申请号 JP20090518927 申请日期 2007.07.11
申请人 发明人
分类号 G01R33/02;G01R33/04;G01R33/07;G01R33/09;H01L21/60;H01L21/822;H01L25/00;H01L27/04;H01L43/00;H01L43/02;H01L43/04;H01L43/06;H01L43/08 主分类号 G01R33/02
代理机构 代理人
主权项
地址