| 摘要 |
The object of the present invention is to provide a thermosetting compound having dielectric properties, in particular permittivity and dielectric loss, which are improved compared to prior art, a composition containing the same, and a molded article. The thermosetting compound according to the present invention is a dihydro benzoxazine compound represented by the following Formula (2), where, R6 to R13 represent a hydrogen atom, an alkyl group, or the like, and R14 represents a divalent saturated alicyclic hydrocarbon group having a condensed ring structure.
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