摘要 |
PROBLEM TO BE SOLVED: To provide a fluid polishing device capable of improving a polishing rate in fluid polishing. SOLUTION: This fluid polishing device is provided with a nozzle 40 having an injection port 42 by which slurry 3 for polishing a surface 2a of a polishing object 2 is injected, and a reflection head 50 having a reflecting surface 51 arranged oppositely to the injection port 42 and reflecting the slurry 3 injected from the nozzle 40 toward the surface 2a of the polishing object 2 by the reflecting surface 51. The reflecting surface 51 of the reflection head 50 is formed into a curved surface shape having a geometrical focus. In the reflection head 50, the focus of the reflecting surface 51 is located in the surface 2a of the polishing object 2 or in the vicinity of the surface 2a, and the slurry 3 reflected from the reflecting surface 51 is arranged to be substantially converged at the focus. COPYRIGHT: (C)2010,JPO&INPIT
|