| 摘要 |
PURPOSE: A wafer dividing method is provided to expand the dicing tape adhering the rear side of wafer in the surface of the dicing tape and to give the external force to the wafer. CONSTITUTION: A device is formed in a plurality of regions divided with a plurality of streets(22) formed in the surface of the substrate(21) into the lattice type. The wafer(2) in which film is coated in the surface of street partitions according to street to each device. The laser machining groove(240) is formed. The degraded layer is formed inside substrate according to street. The rear side of substrate is grinded and wafer is formed of the prescribed thickness. The external force is given to the wafer in which the back-grinding process is performed and the wafer is partitioned according to street.
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