发明名称 Circuit substrate, especially a multilevel circuit board for SMD components, comprising conductive structures on or within insulating layers
摘要 A circuit substrate, comprising conductive structures on or within insulating layers, also has an optical layer (1) embedded at both sides in the layers (6, 7).- DETAILED DESCRIPTION - Preferred Features: An electrically conductive polymer layer, circuit board layers (6, 7) and/or a thermally conductive prepreg layer may adjoin one or each side of the optical layer. The optical layer is in the form of a multimode waveguide
申请公布号 DE19826658(A1) 申请公布日期 1999.12.30
申请号 DE19981026658 申请日期 1998.06.16
申请人 SIEMENS AG 发明人 MEHLHORN, TORSTEN;BIRKHOLTZ, PETER;PROEBSTER, WALTER
分类号 G02B6/43;H05K1/02;(IPC1-7):G02B6/12;H05K1/03;H05K3/46 主分类号 G02B6/43
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