发明名称 |
Circuit substrate, especially a multilevel circuit board for SMD components, comprising conductive structures on or within insulating layers |
摘要 |
A circuit substrate, comprising conductive structures on or within insulating layers, also has an optical layer (1) embedded at both sides in the layers (6, 7).- DETAILED DESCRIPTION - Preferred Features: An electrically conductive polymer layer, circuit board layers (6, 7) and/or a thermally conductive prepreg layer may adjoin one or each side of the optical layer. The optical layer is in the form of a multimode waveguide
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申请公布号 |
DE19826658(A1) |
申请公布日期 |
1999.12.30 |
申请号 |
DE19981026658 |
申请日期 |
1998.06.16 |
申请人 |
SIEMENS AG |
发明人 |
MEHLHORN, TORSTEN;BIRKHOLTZ, PETER;PROEBSTER, WALTER |
分类号 |
G02B6/43;H05K1/02;(IPC1-7):G02B6/12;H05K1/03;H05K3/46 |
主分类号 |
G02B6/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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