ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a useful organic insulating material having low dielectric constant, high heat resistance and high mechanical strength. Also disclosed are a resin film using the organic insulating material and a semiconductor device. The organic insulating material contains a prepolymer composed of an adamantane structure compound having a group containing a polymerizable unsaturated bond. The prepolymer has a number average molecular weight of not less than 2,000 but not more than 500,000 in terms of polystyrene as determined by gel permeation chromatography. The group containing a polymerizable unsaturated bond is preferably a group containing a carbon-carbon triple bond. The resin film is obtained by a crosslinking reaction and a condensation reaction of the organic insulating material or a varnish for resin films containing the organic insulating material, which reactions are caused by heating and/or irradiation of an active radiation ray.