| 摘要 |
THE PRESENT INVENTION GENERALLY RELATES TO AN INTEGRATED CIRCUIT PACKAGE, MORE SPECIFICALLY TO AN ULTRA- THIN MICRO LEAD FRAME PACKAGE (UT-MLP). THE UT-MLP COMPRISES A LEAD FRAME (2.1) HAVING A DIE PAD (2.2) AND A PLURALITY OF LEADS (2.3). A SILICON DIE (2.4) ATTACHED TO THE DIE PAD (2.2) AND A PLURALITY OF BOND WIRE (2.5) CONNECT THE SILICON DIE (2.4) TO THE PLURALITY OF LEADS (2.3). TO COMPLETE THE PACKAGE A PLASTIC ENCAPSULATION (2.6) IS APPLIED TO THE LEAD FRAME (2.1). TO KEEP HEIGHT TO A MINIMUM THE PLASTIC ENCAPSULATION (2.6) IS APPLIED TO ONE SIDE OF THE LEAD FRAME (2.1).
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