发明名称 METHOD AND APPARATUS FOR PLACING SUBSTRATE SUPPORT COMPONENTS
摘要 An apparatus for depositing viscous material on an electronic substrate includes a frame, a unit coupled to the frame, the unit being configured to deposit material on the electronic substrate, and a substrate support assembly coupled to the frame. The substrate support assembly is configured to support the electronic substrate. The substrate support assembly includes a plurality of support elements, a table coupled to the frame, the table having a support surface to support at least one support element of the plurality of support elements, a placement head configured to releasably secure the at least one support element, and a transport device coupled to the frame and the placement head. The transport device is configured to move the placement head relative to the table in both X and Y directions to place the at least one support element on the support surface of the table in a predetermined position. The apparatus further includes an imaging system coupled to the frame and a controller coupled to the imaging system. The imaging system is configured to capture images of the support surface of the table. The controller is configured to verify whether the at least one support element is placed on the predetermined position on the support surface of the table based on images captured by the imaging system. Other embodiments of the apparatus and related methods are further disclosed.
申请公布号 WO2009102513(A3) 申请公布日期 2009.11.26
申请号 WO2009US30717 申请日期 2009.01.12
申请人 ILLINOIS TOOL WORKS INC.;PERAULT, JOSEPH, A.;FOSTER, STEVEN, R. 发明人 PERAULT, JOSEPH, A.;FOSTER, STEVEN, R.
分类号 H05K13/00;H05K13/04 主分类号 H05K13/00
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