发明名称 MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of suppressing the occurrence of warpage and cracks without depending on a multilayer structure. SOLUTION: The multilayer substrate 1 includes an insulating sheet 2 obtained by baking a green sheet 6, and an insulating sheet 3 obtained by baking a green sheet 7 laminated on the green sheet 6 while having a relative dielectric constant different from that of the insulating sheet 2. The insulating sheet 2 is made up of a Zn-Nb-Ca-Ti oxide based ceramic material containing B<SB>2</SB>O<SB>3</SB>, the insulating sheet 3 is made up of a Zn-Nb-Ca-Ti oxide based ceramic material containing Mg<SB>2</SB>SiO<SB>4</SB>and B-Z-Si based glass, the difference of thermal expansion coefficients between the insulating sheet 2 and the insulating sheet 3 is≤0.5×10<SP>-6</SP>/°C, and the difference of percentages of contraction between the green sheet 6 and the green sheet 7 is within 1% when baking them. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009277831(A) 申请公布日期 2009.11.26
申请号 JP20080126797 申请日期 2008.05.14
申请人 YOKOWO CO LTD 发明人 RA MINORU;YAMAKAWA TAKAHIRO
分类号 H05K3/46;B32B18/00 主分类号 H05K3/46
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