| 摘要 |
PURPOSE: A light emitting package and a manufacturing method thereof are provided to improve light emitting efficiency and reduce color deviation. CONSTITUTION: A light emitting device package includes a semiconductor substrate(11b), a lighting emitting unit(25), a first conductive layer, and a second conductive layer. A first surface is formed with a first depth from an upper surface. A second surface is formed with the second depth from a second surface. The light emitting unit is provided to the second surface of the semiconductor substrate. The first conductive layer is connected to a first electrode of the light emitting unit. The second conductive layer is connected to the second electrode of the light emitting unit. The semiconductor substrate is a silicon substrate. |
