| 摘要 |
A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.
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