发明名称 PLATING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plating apparatus capable of solving the problem that since a driving system and a control system are installed in a plating bath in the plating process of a general rotary barrel plating, when a large number of plating baths are provided, the scale of the plating line is increased, and in this case, not only the area productivity is low but also the cost for the facility operation and the cost for facility maintenance are increased, and a high-mix low-volume production cannot be achieved. Ž<P>SOLUTION: In the plating apparatus comprising the plurality of plating baths, a rotary barrel, and a conveying means of the rotary barrel among the plating baths, the rotary barrel includes a rotation-driving mechanism, a rotational speed detection mechanism, a rotation control mechanism for feeding back the result of detection of the rotational speed to the rotation-driving mechanism, and a function of recognizing the plating bath at which the rotary barrel is located. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009275259(A) 申请公布日期 2009.11.26
申请号 JP20080127309 申请日期 2008.05.14
申请人 MURATA MFG CO LTD 发明人 KAWAKAMI EIJI;NISHIZAWA AKIRA
分类号 C23C18/31 主分类号 C23C18/31
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