| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuits connecting material that is cured even in such a short time as 10 seconds or less and offers stable reliability of connection for connecting OSP-processed substrates and a connection structure of a circuit member using the same. <P>SOLUTION: The circuits connecting material electrically connects circuit electrodes mutually faced, wherein it contains a curing agent that generates an uncombined radical, a radical polymerizable substance, ester phosphate, and conductive particles, and per 100 pts.wt of the total circuits connecting material excluding the conductive particles, the proportion of the ester phosphate contained therein is within the range of 0.5 to 2.5 pts.wt. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
