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发明名称
Verfahren zum Bilden einer Verbindungsstruktur für eine Halbleitervorrichtung
摘要
申请公布号
DE102005027234(B4)
申请公布日期
2009.11.26
申请号
DE200510027234
申请日期
2005.06.13
申请人
SAMSUNG ELECTRONICS CO. LTD.
发明人
PARK, JIN-TAEK;PARK, JONG-HO;HUR, SUNG-HOI;KIM, HYUN-SUK
分类号
H01L21/3205;H01L21/768;H01L21/283;H01L21/4763;H01L23/522;H01L27/115
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
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