PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE AND METHOD OF MANUFACTURING THEREFOR

摘要

There is disclosed a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is coplanar with the surface of the raised portion of the metal plate.