FLAW REVIEWING METHOD AND FLAW REVIEWING APPARATUS

摘要

<P>PROBLEM TO BE SOLVED: To provide a method for acquiring data useful for a later review in the case where the flaw of a semiconductor device or the like in a manufacturing process is discovered. Ž<P>SOLUTION: A flaw reviewing method is executed by flaw reviewing devices 24 and 25 equipped with: a memory part 32 for receiving the input of the flaw data 21 related to an inspection target acquired by a visual examination device 1 to store the flaw data; an image acquiring part for acquiring the image related to the inspection target; and a processing part 31 for acquiring the flaw reviewing data based on the flaw data using the image acquiring part. The processing part determines whether a cluster showing the gathering of flaws is present in the flaw data 22b and 23b read from the memory part and acquires the image of the flaw part being a part of the cluster in relation to the inspection target and additional data using the image acquiring part on the basis of the distribution feature of the cluster in the case where the cluster is determined to exist. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž