| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming method having high flexibility for the formable film thickness, while omitting extra processes. <P>SOLUTION: In the processes of bringing a liquid material 2, prepared by dispersing fine particles in a colloid into contact with a substrate 1 and irradiating the substrate 1 with an energy beam 7 to fix at least one component in the liquid material 2 onto the substrate 1, at least a part of the substrate 1 is not in contact with the liquid material 2, and the energy beam 7 is to be made incident from a part where the substrate is not in contact with the liquid material 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
