WIRING BOARD FOR CHIP ON FILM, PREPARING METHOD THEREOF AND CHIP ON FILM

摘要

A wiring board for chip on film, a preparing method thereof and a chip on film is provided to thin an insulation film covering the surface of a semiconductor device by half-etching an insulation film part on a region where an inner lead does not exist. In a wiring board for chip on film, a metal wire is arranged on one surface of an insulation film(1). The metal wire has an inner lead(9) for connection with a semiconductor device and an outer lead for connection with an external substrate. The thickness of the insulation film in a region in which the inner lead does not exist on the region on which the semiconductor device is mounted is thinner than the thickness of the insulation film on the region where the semiconductor device is not mounted.