| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which can fulfill flame retardancy in spite of containing no halogen-containing compound and can give a laminate sufficient in soldering heat resistance and fabricability and to provide a prepreg using the same and a laminate. Ž<P>SOLUTION: Provided are a resin composition which is one used to form a sheet prepreg by impregnation of a substrate therewith and comprises a specified high-molecular-weight epoxy resin (a) having repeating units each comprising a naphthalene skeleton and a phenylene skeleton and a specified low-molecular-weight epoxy resin (b) having two naphthalene skeletons, a prepreg and a laminate using the same. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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