| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat-dissipating structure, capable of providing high heat radiation performance and eliminating the failures due to high thermal resistance, leakage from a coating section, or the like, generated by using thermocondcutive grease. <P>SOLUTION: The heat dissipation structure comprises: a substrate, namely an insulating material; an aluminum carbide phase or an aluminum oxide phase formed on at least the entire surface of the substrate or on one portion thereof; and an aluminum carbide whisker layer or an alumina whisker layer formed by erecting a plurality of aluminum carbide whiskers or alumina whiskers from the aluminum carbide phase or aluminum oxide phase on the substrate surface. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
