WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A wafer level camera module and a manufacturing method thereof for obtaining EMI/EMC shield effect without additional metallization process are provided to reduce the size of a camera module, a manufacturing process and a cost. CONSTITUTION: A wafer level camera module(100) includes an image sensor wafer(10), a wafer lens(70), a molding material(90). An image charge coupled device and a transparent member are included in the upper side of the image sensor wafer. An external connection unit is equipped on the lower part of the image sensor wafer. The wafer lens is laminated on the transparent member of the image sensor wafer. The molding material is formed in both sides of the wafer lens and the image sensor wafer including the transparent member.