发明名称 |
Interpenetrating network for chemical mechanical polishing |
摘要 |
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates. |
申请公布号 |
US2009280725(A1) |
申请公布日期 |
2009.11.12 |
申请号 |
US20090504189 |
申请日期 |
2009.07.16 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
MULDOWNEY GREGORY P |
分类号 |
B24B1/00;B24D99/00;B24B37/04 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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