| 摘要 |
PURPOSE: A semiconductor device and a method for manufacturing a semiconductor are provided to increase process efficiency and yield by picking up the semiconductor device rapidly. CONSTITUTION: A semiconductor apparatus(10) includes a pick-up unit, a base, a porous chuck(200), and a support mask unit. The pick-up unit picks up a semiconductor device arranged in one side of a tape. A vacuum unit is arranged in the base. The porous chuck is connected to the porous chuck. A tape(30) arranging the semiconductor device is arranged in an upper side of the porous chuck. A support mask unit(400) includes a support mask penetration unit(430) and is arranged in one side of the porous chuck between the tape and the porous chuck. The support mask penetration unit is arranged between a support mask frame and support mask bars(420) connected to an inner side of the support mask frame. The support mask penetration unit passes the fluid between the tape and the porous chuck.
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