MANUFACTURING MICRO COMPONENTS INCLUDING A COVER STRUCTURE

摘要

Method for manufacturing components (5) comprising the steps of manufacturing a carrier layer (4) including a plurality of said components, and manufacturing a cover structure and applying it to the wafer. The cover structure has the shape of a preformed foil (2), arranged to cover over each individual component and to be adhered to the wafer around each individual component. The foil shaped cover structure (2) is manufactured using at least one moulding part (1). The mould (1), including the cover structure (2), is moved to the wafer (4) with the plurality of components. Via the mould, the cover structure is pressed to the wafer and the cover structure is adhered to the wafer in the areas (7) around the individual components, after which the cover structure is released from its mould by means of gas or air pressure.