| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable contributing to further miniaturization by enabling bumps and an inductor to coexist on a single substrate even when the inductor is somewhat large compared to a substrate area. <P>SOLUTION: The semiconductor device 1A(1) includes: a semiconductor substrate 10 equipped with an electrode 3 on at least one surface; a first insulating resin layer 11 disposed so as to cover the one surface of the semiconductor substrate; a first conductive layer 12 disposed on the first insulating resin layer and electrically connected to the electrode; a second insulating resin layer 13 disposed on the first conductive layer; a second conductive layer 14 disposed on the second insulating resin layer and electrically connected to the first conductive layer; and bumps 15 electrically connected to the second conductive layer. One parts of the first conductive layer and the second conductive layer constitute a portion 14a functioning as an inductor, and the bumps and the inductor are at a position where they do not overlap in plan view. <P>COPYRIGHT: (C)2010,JPO&INPIT |
