发明名称 |
METHOD AND APPARATUS TO IMPROVE FRIT-SEALED GLASS PACKAGE |
摘要 |
<p>A hermetically sealed package includes: a first plate including inside and outside surfaces; a second plate including inside and outside surfaces; frit material disposed on the inside surface of the second plate; and at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.</p> |
申请公布号 |
EP2115797(A1) |
申请公布日期 |
2009.11.11 |
申请号 |
EP20080725758 |
申请日期 |
2008.02.19 |
申请人 |
CORNING INCORPORATED |
发明人 |
CHATTERJEE, DILIP, K.;NGUYEN, KELVIN |
分类号 |
H01L51/52 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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