发明名称 |
Assembly in pressure contact with a power semiconductor module |
摘要 |
Power semiconductor module with a pressure contact comprises circuit board (100), cooling body (300b) and a semiconductor power module (200) with an insulated plastic housing (210) and cover (212) with recesses. A second cover has a substrate (230) with semiconductor elements (240) and contact spring connections with reversible or permanent connections. |
申请公布号 |
EP1592063(A3) |
申请公布日期 |
2009.11.11 |
申请号 |
EP20050004622 |
申请日期 |
2005.03.03 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG |
发明人 |
POPP, RAINER;LEDERER, MARCO;GOEBL, CHRISTIAN;STOCKMEIER, THOMAS, DR. |
分类号 |
H01L25/16;H01L23/34;H01L23/36;H01L23/40;H01L23/48;H01L25/07;H05K1/03;H05K1/14;H05K3/32 |
主分类号 |
H01L25/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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