| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a power module which prevents insulation failure of a power module caused by the generation of voids or the formation of an air path in a joint portion between a housing and a cooler and burning loss resulting from this, and manufactures a compact power module at a low cost as much as possible. <P>SOLUTION: This manufacturing method is used to manufacture a power module 10, wherein a circuit unit 7 comprised of an insulation substrate 5 and a semiconductor device 4 is placed and fixed on a cooler 2, a housing 1 surrounding the circuit unit 7 on the cooler 2 is placed and fixed, and a sealing resin 3 is formed in the housing 1. The housing 1 and the cooler 2 are joined by heat crimping. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
