| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus achieving improved control accuracy of polishing pressure. <P>SOLUTION: This polishing apparatus is provided with: a pad pressurization mechanisms 224 pressing polishing pads 220 by wafers by the use of pressure of air supplied from an air pressure source A; and first electropneumatic regulators 61 arranged in conduits 50, 60 connecting the air pressure source A to the pad pressurization mechanisms 224 and controlling pressure of air supplied from the air pressure source A to the pad pressurization mechanisms 224. The first electropneumatic regulators 61 control air pressure within a range of positive pressure and vacuum, and have venturi tubes 62 forcibly exhausting air in the conduits 60 connecting the first electropneumatic regulators 61 to the pad pressurization mechanisms 224 when depressurizing air pressure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
