| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for electronic parts, forming a cured product which has proper flexibility in a wide temperature region from low temperature to high temperature, has elastic modulus whose change depending on temperature is highly less than those by conventional techniques, is excellent in adhesiveness, does not cause large warp in electronic parts, such as semiconductor chips, adhered to substrates, and does not form a crack, even when a solder is reflowed. Ž<P>SOLUTION: Provided is an adhesive for electronic parts, comprising a curable compound and a curing agent, characterized in that the curable compound contains an epoxy compound having epoxy groups at both the ends of the molecule and having a flexible skeleton having a number-average mol.wt. of 50 to 10,000 between one epoxy group and the other epoxy group; and the curing agent is a mixture of particles which is solid at ordinary temperature and comprises tri- or more-functional acid anhydride curing agent, with a bifunctional acid anhydride curing agent which is liquid at ordinary temperature. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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