发明名称 Transport housing for an electronic flat module
摘要 A transport housing for receiving an electronic flat assembly, the electronic assembly having at least one controllable electronic component in the form of a DIP switch and a connecting line, has two housing halves receiving the flat assembly, wherein the one housing half is inserted at least partially into the other housing half, and wherein the two housing halves have a plurality of molded elements that are disposed in a staggered arrangement, for creating a molded lock having two detent positions successively disposed in the locking direction.
申请公布号 US2009273906(A1) 申请公布日期 2009.11.05
申请号 US20070310691 申请日期 2007.08.23
申请人 BOHNEN PETER;MIHAILOVIC PHILIP 发明人 BOHNEN PETER;MIHAILOVIC PHILIP
分类号 H05K7/00 主分类号 H05K7/00
代理机构 代理人
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