| 发明名称 |
DYNAMIC PAD SIZE TO REDUCE SOLDER FATIGUE |
| 摘要 |
A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate. |
| 申请公布号 |
KR20090115136(A) |
申请公布日期 |
2009.11.04 |
| 申请号 |
KR20097016182 |
申请日期 |
2008.01.23 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
PHAM TIM V.;UEHLING TRENT S. |
| 分类号 |
H01L21/60;H05K3/34 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
