| 发明名称 |
INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN A MICROSTRUCTURE DEVICE BY USING ALUMINUM NITRIDE |
| 摘要 |
By forming an aluminum nitride layer (106) by a self-limiting process sequence, the interface characteristics of a copper-based metallization layer may be significantly enhanced while nevertheless maintaining the overall permittivity of the layer stack at a lower level. |
| 申请公布号 |
KR20090115190(A) |
申请公布日期 |
2009.11.04 |
| 申请号 |
KR20097018207 |
申请日期 |
2008.01.31 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
STRECK CHRISTOF;KAHLERT VOLKER |
| 分类号 |
H01L21/768;H01L21/314 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
