| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing solution for a copper film that achieves not only high polishing speed but also preferred uniform polishing speed inside a surface in addition to contributing to the high quality of LSI and the like using a copper wiring, and to provide a method of polishing a substrate. <P>SOLUTION: The method is provided for polishing a substrate where a metal film is polished by relatively moving a polish table and substrate, while the substrate with the metal film is pressed to a polishing cloth while supplying a solution for polishing a metal containing an oxidizing agent, a resolvent for metal oxide, a water soluble polymer, a nitrogen containing heterocyclic compound, water and an agent for improving uniformity of the polishing speed inside the surface of the copper. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
