| 摘要 |
PROBLEM TO BE SOLVED: To suppress an interference level between a plurality of power supply systems in a high frequency band of 1 GHz or more, and to enable a high-density packaging instrument utilizing the high frequency band to be made. SOLUTION: Power supply planes 4, 5 isolated by a slit 6 are formed inside the same layer through an insulating layer 3 on a grounding layer 2, a grounding plane 8 is formed on the side opposite to the grounding layer 2 with respect to a power supply layer and across an insulating layer 7 with respect to the power supply layer so as to coat the slit 6 completely, and the grounding layer 2 is connected to the grounding plane 8 by a plurality of vias 9 disposed so as to have an appropriate interval therebetween. COPYRIGHT: (C)2010,JPO&INPIT |
