发明名称 JOINT COVER DEVICE FOR FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a joint cover device for a floor which can prevent a side plate of a filling casing provided in a cover body from being deformed due to thermal warpage when the cover body formed of a thin steel plate is hot-dip galvanized. SOLUTION: Thermal-warpage prevention edges 10 and 10 are formed at least at upper ends of right and left side wall plates 7 and 7 along the width direction of a joint (s) of the filling casing 5 composed of the thin steel plate constituting the cover body C by bending upper edges of the right and left side wall plates 7 and 7 in inside directions, respectively. The strength of the right and left side wall plates 7 and 7 can be increased by the thermal-warpage prevention edges 10 and 10 so as to prevent the side wall plates 7 and 7 from being deformed due to thermal warpage when the cover body C is hot-dip galvanized. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009250001(A) 申请公布日期 2009.10.29
申请号 JP20080103045 申请日期 2008.04.11
申请人 KANESO CO LTD 发明人 KOBAYASHI MASAKAZU
分类号 E04B1/62 主分类号 E04B1/62
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