发明名称 |
LEAD FRAME AND ELECTRONIC DEVICE OF EFFECTIVE THERMAL EMISSION STRUCTURE FOR VERY LARGE CURRENT OPTICAL SOURCE LAMP AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A lead frame for the mounting of the chip which has the effective heat radiation structure for the large area light source lamp, and an electric component and a manufacturing method thereof are provided to improve the light diffusion about the light emitted from the LED chip. CONSTITUTION: PCB forms at least one penetration hole(21) and at least two electrode lead. A chip(90) is set up on the metal plate of the penetration hole area. A transparent resin(80) molds the surrounding of a chip with the predetermined fluorescence agent. At least one penetration hole for the chip mounting and at least two electrode leads(12) are formed on the front side of PCB. A metal coating layer(51/52) is formed on a metal layer(14) formed on an electrode lead(12) and a lead frame. |
申请公布号 |
KR20090113115(A) |
申请公布日期 |
2009.10.29 |
申请号 |
KR20080039025 |
申请日期 |
2008.04.25 |
申请人 |
ITSWELL CO., LTD. |
发明人 |
YU, SOON JAE;CHOI, YONG SEOK;CHUNG, CHEON KEE |
分类号 |
H05K7/20;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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